IEC INTERNATIONAL 60191-6-3 STANDARD First edition 2000-09 HNTERTAMESEN HISLOCANONBANYASORLED BY BOK SUPLY BURAU. Mechanical standardization of semiconductor devices Part 6-3: Ll General rules for the preparation of outline drawings of surface mounted semiconductor device packages NC CHI Measuring methods for package dimensions of quad flat packs (QFP) Normalisation meécanique des dispositifs a semiconducteurs - Partie 6-3: Regles générales pourla préparation des dessins d'encombrement des dispositifs a semiconducteurs a montage en surface - Méthodes de mesure pour les boitiers plats quadrangulaires (QFP) IEC Reference number IEC 60191-6-3:2000(E) Numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. Consolidated publications Consolidated versions of some IEC publications including amendments are available. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the publication incorporating amendments 1 and 2. Validity of this publication HOENSERTAMSEN HISLOCEANIONBANYASORLIED BY BO SLY BUREAU. Thetechnical content of IEC publications iskept under constant reviewbythe IEC, thus ensuring that the content reflects current technology. Information relating to the date of the reconfirmation of the publication is available in the IEC catalogue. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the list of publications issued, is to be found at the following iEC sources: IEC website* Catalogue of IEC publications Published yearly with regular updates (On-line catalogue)* IEC Bulletin Available both at the IEC web site* and as a printed periodical SUP Terminology, graphical and letter symbols For general terminology, readers are referred to IEC 60050: International ElectrotechnicalVocabulary (IEV). For graphical symbols, and letter symbols and signs approved by the IEc for general use, readers are referred to publications IEC 60027: Letter symbols to be used in electrical technology, IEC 60417: Graphical symbols for use on equipment. Index, survey and compilation of the single sheets and IEc 60617: Graphical symbols for diagrams. See web site address on title page. IEC INTERNATIONAL STANDARD 60191-6-3 First edition 2000-09 NAAYOOKSULBURAU Mechanical standardization of semiconductor devices Part 6-3: Ll General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP) Normalisation mécanique des dispositifs a semiconducteurs Partie 6-3: Regles générales pourla préparation des dessins d'encombrement des dispositifs a semiconducteurs a montage en surface - Méthodes de mesure pour les boitiers plats quadrangulaires (QFP) IEc 2000 — Copyright - all rights reserved mechanical, including photocopying and microfilm, without permission in writing from the publisher. InternationalElectrotechnicalCommission 3,rue deVarembe Geneva,Switzerland Telefax: +41 22 919 0300 e-mail: [email protected] IEC web site http://www.iec.ch Commission Electrotechnique Internationale PRICE CODE Q EC International Electrotechnical Commission MemAyHapoAHan 3nekTpoTexHMyeCkan KoMuCCuA Forprice, see current catalogue